【課題】非接触ＩＣカードの部品実装段階において、実 装設備の簡略化と実装工数の低減を図ることを目的とす る。また、カードを動作させるために必要な電子部品の 最適値を自由に得ることを目的とする。
【解決手段】電子回路を構成するＩＣチップ１と、電子 部品を構成するシリコンチップ２を同一実装工法にて回 路基板３へ実装する。
PROBLEM TO BE SOLVED: To simplify the equipment, and reduce manhours at the time of a card manufacturing without using a mounting equipment corresponding with respective shapes and mounting methods of parts by mounting silicon chips having an IC chip and electronic parts, by the same method. SOLUTION: A circuit substrate 3 on which an IC chip 1 constituting an electronic circuit which performs the processing of information, and a silicon chip 2 by which an electronic part such as a condenser is formed, are respectively mounted, is provided. In addition, an antenna coil 4 which is connected to the circuit substrate 3, receives a driving energy, and transmits/receives information by an electric wave to/from a terminal device, is arranged along the inside of the outer periphery of a card. The IC chip 1 and the silicon chip 2 are bonded on the circuit substrate 3, and then, both of them are mounted by a wire bonding method. By this method, the mounting equipment can be simplified, and at the same time, the reduction of manhours can be realized as well.